Discover golden opportunities with Bond University scholarships in Australia! Unveiling the path to academic excellence, this blog post brings you exciting news—Bond University is currently accepting applications for its undergraduate scholarships for international students for the academic year 2024.
In this comprehensive guide, we’ll delve into the details of these scholarships, explore their incredible benefits, and provide a step-by-step walkthrough of the application process.
International students seeking undergraduate studies have the chance to apply for these partially sponsored scholarships. Exclusively tailored for bachelor’s degree pursuits, these scholarships offer a remarkable 50% waiver on tuition fees for successful applicants.
At Bond University, tuition remission scholarships await exceptional academic achievers residing outside of Australia, specifically designed for those embarking on their undergraduate journey. The Excellence in Undergraduate Education Scholarships celebrate academic merit, showcasing Bond University’s commitment to fostering high-quality education for international students.
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Join us on this journey of educational empowerment as we unravel the details of Bond University Scholarships—your gateway to an exceptional academic experience in Australia.
Interesting Facts About Bond University
Bond University, situated in Robina, Queensland, stands as Australia’s pioneering private, non-profit university. Since its establishment on May 15, 1989, Bond has maintained a strong focus on providing high-quality teaching in the realm of higher education, operating on a distinctive three-semester-per-year academic calendar.
In the prestigious Times Higher Education (THE) rankings for the Best Small Universities in the World, Bond University holds an impressive 20th position. Admissions to the university are facilitated by the Queensland Tertiary Admissions Centre, where eligibility is determined based on the Australian Tertiary Admissions Rank (ATAR).
A testament to its commitment to student satisfaction, Bond University earned the third-highest student happiness rating among all Australian institutions and claimed the top spot for student satisfaction among all Queensland universities in the 2019 Student Experience Survey. The university achieved an outstanding overall satisfaction rating of 87.2.
Founded and financially supported in 1987, Bond University is the result of collaborative efforts led by India’s founder and silent partner, Mr. Harunori Takahashi, Dr. Taro Tanioka (President of Electronics and Industrial Enterprises International in Japan), and Mr. Alan Bond (Chairman of Bond Corporation in Australia). This joint venture was established to oversee the land and construction of Bond University.
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Initially spanning approximately 212 hectares, the university’s grounds included the Burleigh Forest, a former pine plantation. To facilitate development, Bond established the Development Equity Corporation (DEC), taking control of pine plantations previously managed by the Savoy Corporation Limited and the Gold Coast Cooperative Plantations Society Limited.
Under the direction of Brian Orr, DEC proposed the idea of a university at Gaven Forest to the Albert Shire Council in 1976, although this concept did not progress. Subsequently, a successful proposal in 1986 led to the creation of a university near Burleigh Forest. Orr, in collaboration with Bond and Peter Beckwith, engaged Jo Anne Cracknell to investigate the feasibility of this ambitious venture.
Bond University Scholarship Highlights
- Level of Study: Undergraduate
- University Name: Bond University
- Award: 50% tuition fee
- Study in: Australia
- Program Period: Four years
- Application Deadline: Applications are open
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Courses Offered
- Actuarial Science
- Architecture and Built Environment
- Business and Commerce
- Communication and Creative Media
- Health Sciences
- Hotel and Tourism
- International Relations and Humanities
- Law
- Sport
- Academic & English Pathways
- Executive Programs
For further details about the undergraduate programs, click Here.
Bond University Scholarship Benefits
Bond University Scholarships provide the recipients with the following benefits:
- Recipients of the Undergraduate Excellence Scholarship are awarded 50% tuition remission for their chosen program.
- The following programs are not eligible for consideration for the scholarships: Master of Psychology, Study Abroad and Exchange Programs, Bachelor of Medical Studies and Doctor of Physiotherapy.
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Eligibility for Bond University Scholarships
Applicants must fulfill the following criteria for Bond University scholarships:
- Required Languages: English
- Eligible Countries: All World countries
- You must have already received an offer from Bond University to commence an undergraduate degree. Students who have not yet received an offer can apply via the Bond University Online Application Form. The following programs are not eligible for consideration for scholarships: Master of Psychology, Study Abroad and Exchange Programs, Bachelor of Medical Studies and Doctor of Physiotherapy
- Currently reside outside of Australia. Those studying English at Bond University College as part of a packaged offer are still eligible to apply.
- You must have outstanding academic ability.
- Complete and submit the Undergraduate Excellence Scholarship Application Form by the scholarship application closing date relevant to the chosen starting semester.
- You must not have already commenced undergraduate or postgraduate studies at Bond University.
Also check: University of Technology Sydney Scholarship 2024 Australia | International Students
How to Apply for Bond University Scholarships?
Please follow the following application instructions to win Bond University scholarships:
- Complete the Bond University Online Application Form to receive their program offer before applying for this scholarship.
- Once an offer has been received, students must complete the Undergraduate Excellence Scholarship Application Form. The form must be completed in full and returned to international@bond.edu.au by the relevant application closing date.
